Heat transfer measurements in electronics cooling applications | Electronics Cooling
Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective | SpringerLink
Realization of an E-type coaxial surface junction thermocouple: (a)... | Download Scientific Diagram
Single material thermocouples from graphite traces: Fabricating extremely simple and low cost thermal sensors - ScienceDirect